Broadwell-E Core Release Date for Intel i7 HEDT CPUs Set for 2016
Intel is already sharing the first details of its next high-end desktop (HEDT) processors, codenamed “Broadwell-E”. These are Intel’s next Core i7 HEDT chips which will be built in the existing LGA2011v3 package.
They will be compatible with existing motherboards based on Intel’s X99 Express chipset thanks to BIOS updates, of course. However, the architecture won’t be seriously improved, as there are said to be only iterative changes.
Intel’s Core i7 “Broadwell-E” will be built in the 14 nanometer silicon, featuring 6 to 8 cores based on the “Broadwell” micro-architecture with up to 20 MB of L3 cache. Here are some more details of pertaining to these upcoming chips:
The chip is pin-compatible to “Haswell-E,” and so its I/O will be identical, featuring a quad-channel DDR4 integrated memory controller. One difference is that Intel may can the 28-lane PCIe approach with the entry-level part; or at least it doesn’t find mention on the slide. If it’s true, all parts based on this silicon, will feature 40-lane PCIe interfaces. The TDP of these chips will be rated at 140W. Intel is expected to launch the Core i7 “Broadwell-E” in 2016.
Also, according to a recent report from VR-Zone.com, the rumor has it that the Broadwell-E line of Core i7 HEDT central processing units will be released only in 2016, not in 2015, so there’s still plenty of time to wait until then.